DocumentCode :
1112563
Title :
Recombination lifetime in oxygen-precipitated silicon
Author :
Hwang, J.M. ; Schroder, Dieter K. ; Goodman, A.M.
Author_Institution :
Westinghouse R&D Center, Pittsburgh, PA
Volume :
7
Issue :
3
fYear :
1986
fDate :
3/1/1986 12:00:00 AM
Firstpage :
172
Lastpage :
174
Abstract :
The recombination lifetime degrades when interstitial oxygen precipitates in Czochralski-grown silicon. We have observed a more severe degradation in p-type than in n-type material. Based on recombination lifetime, deep-level transient spectroscopy, Fourier-transform infra-red transmission, and transmission electron microscopy measurements, we attribute the degradation mainly to interface states at the precipitate-silicon interface acting as recombination centers. Positive charge in the oxygen precipitates (OP´s), causing an electron-attractive space-charge region (scr) around the precipitate in p-Si and a hole-repulsive accumulation layer in n-Si, is proposed to explain the lifetime differences between n-type and p-type silicon.
Keywords :
Annealing; Degradation; Energy states; Interface states; Shape; Silicon; Solid state circuits; Spectroscopy; Spontaneous emission; Temperature;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26334
Filename :
1486157
Link To Document :
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