The successful application of short-term halogen lamp annealing to form ohmic contacts to AlGaAs/GaAs and In
0.52Al
0.48As/ In
0.53Ga
0.47As modulation-doped structures is demonstrated. Use of Ti in the electron-beam evaporated metallization scheme and a two-step annealing cycle give contacts with reproducibly good electrical and morphological characteristics. Minimum values of specific contact resistance

and

Ω.cm
2for AlGaAs/GaAs and In
0.52Al
0.48As/In
0.53Ga
0.47As, respectively, are measured. Corresponding values of the transfer resistance R
care 0.12 ± 0.02 and 0.18 ± 0.05 Ω.mm. These values are the lowest achieved with lamp annealing and are comparable to the best obtained with transient furnace annealing.