DocumentCode :
1113266
Title :
Characteristics of a 1.2-µm CMOS technology fabricated on an RF-heated zone-melting recrystallized SOI
Author :
Kobayashi, Yutaka ; Fukami, A. ; Nagano, T.
Author_Institution :
Hitachi, Ltd., Hitachi, Japan
Volume :
7
Issue :
6
fYear :
1986
fDate :
6/1/1986 12:00:00 AM
Firstpage :
350
Lastpage :
352
Abstract :
0.7-5-µm CMOSFET´s were fabricated on SOI which was recrystallized using an RF-heated zone-melting recrystallization (RFZMR) method. The leakage currents of n-channel MOSFET´s having gate lengths between 5- and 0.7-µm range between 10-14and 10-12A/µm and show no dependence on channel length. Those of the p-channel MOSFET´s were 10-14-10-12A/µm when the gate lengths were longer than 1.2 µm, and increased when the gate lengths were shorter than 1.0 µm. The propagation delay time of the CMOSFET inverter was 0.13 ns per stage at a supply voltage of 3.5 V.
Keywords :
CMOS technology; CMOSFETs; Crystalline materials; Crystallization; Leakage current; MOSFET circuits; Silicon compounds; Throughput; Ultra large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26397
Filename :
1486220
Link To Document :
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