• DocumentCode
    1113266
  • Title

    Characteristics of a 1.2-µm CMOS technology fabricated on an RF-heated zone-melting recrystallized SOI

  • Author

    Kobayashi, Yutaka ; Fukami, A. ; Nagano, T.

  • Author_Institution
    Hitachi, Ltd., Hitachi, Japan
  • Volume
    7
  • Issue
    6
  • fYear
    1986
  • fDate
    6/1/1986 12:00:00 AM
  • Firstpage
    350
  • Lastpage
    352
  • Abstract
    0.7-5-µm CMOSFET´s were fabricated on SOI which was recrystallized using an RF-heated zone-melting recrystallization (RFZMR) method. The leakage currents of n-channel MOSFET´s having gate lengths between 5- and 0.7-µm range between 10-14and 10-12A/µm and show no dependence on channel length. Those of the p-channel MOSFET´s were 10-14-10-12A/µm when the gate lengths were longer than 1.2 µm, and increased when the gate lengths were shorter than 1.0 µm. The propagation delay time of the CMOSFET inverter was 0.13 ns per stage at a supply voltage of 3.5 V.
  • Keywords
    CMOS technology; CMOSFETs; Crystalline materials; Crystallization; Leakage current; MOSFET circuits; Silicon compounds; Throughput; Ultra large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1986.26397
  • Filename
    1486220