DocumentCode
1113266
Title
Characteristics of a 1.2-µm CMOS technology fabricated on an RF-heated zone-melting recrystallized SOI
Author
Kobayashi, Yutaka ; Fukami, A. ; Nagano, T.
Author_Institution
Hitachi, Ltd., Hitachi, Japan
Volume
7
Issue
6
fYear
1986
fDate
6/1/1986 12:00:00 AM
Firstpage
350
Lastpage
352
Abstract
0.7-5-µm CMOSFET´s were fabricated on SOI which was recrystallized using an RF-heated zone-melting recrystallization (RFZMR) method. The leakage currents of n-channel MOSFET´s having gate lengths between 5- and 0.7-µm range between 10-14and 10-12A/µm and show no dependence on channel length. Those of the p-channel MOSFET´s were 10-14-10-12A/µm when the gate lengths were longer than 1.2 µm, and increased when the gate lengths were shorter than 1.0 µm. The propagation delay time of the CMOSFET inverter was 0.13 ns per stage at a supply voltage of 3.5 V.
Keywords
CMOS technology; CMOSFETs; Crystalline materials; Crystallization; Leakage current; MOSFET circuits; Silicon compounds; Throughput; Ultra large scale integration; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1986.26397
Filename
1486220
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