DocumentCode
1113606
Title
Submicrometer CMOS devices in zone-melting-recrystallized SOI films
Author
Tsaur, Bor-Yeu ; Chen, C.K.
Author_Institution
Massachusetts Institute of Technology, Lexington, MA
Volume
7
Issue
7
fYear
1986
fDate
7/1/1986 12:00:00 AM
Firstpage
443
Lastpage
445
Abstract
CMOS devices with effective channel lengths ranging from 0.7 to 4.0 µm have been fabricated in zone-melting-recrystallized (ZMR) silicon-on-insulator (SOI) films prepared by the graphite-strip-heater technique. Low-temperature processing was utilized to minimize dopant diffusion along subboundaries in the films. Both n- and p-channel devices have low leakage current (<0.1-pA/µm channel width) and good subthreshold characteristics. For ring oscillators with a transistor channel length of 0.8 µm, the propagation delay is 95 ps at a supply voltage of 5 V.
Keywords
CMOS process; CMOS technology; Degradation; Leakage current; Propagation delay; Ring oscillators; Semiconductor films; Silicon on insulator technology; Very large scale integration; Voltage-controlled oscillators;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1986.26430
Filename
1486253
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