DocumentCode :
1113606
Title :
Submicrometer CMOS devices in zone-melting-recrystallized SOI films
Author :
Tsaur, Bor-Yeu ; Chen, C.K.
Author_Institution :
Massachusetts Institute of Technology, Lexington, MA
Volume :
7
Issue :
7
fYear :
1986
fDate :
7/1/1986 12:00:00 AM
Firstpage :
443
Lastpage :
445
Abstract :
CMOS devices with effective channel lengths ranging from 0.7 to 4.0 µm have been fabricated in zone-melting-recrystallized (ZMR) silicon-on-insulator (SOI) films prepared by the graphite-strip-heater technique. Low-temperature processing was utilized to minimize dopant diffusion along subboundaries in the films. Both n- and p-channel devices have low leakage current (<0.1-pA/µm channel width) and good subthreshold characteristics. For ring oscillators with a transistor channel length of 0.8 µm, the propagation delay is 95 ps at a supply voltage of 5 V.
Keywords :
CMOS process; CMOS technology; Degradation; Leakage current; Propagation delay; Ring oscillators; Semiconductor films; Silicon on insulator technology; Very large scale integration; Voltage-controlled oscillators;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26430
Filename :
1486253
Link To Document :
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