DocumentCode :
1114059
Title :
Characteristics of InGaAsP/InP p-DCC lasers grown by the three-melt technique
Author :
Hasenberg, Thomas C. ; Garmire, Elsa M.
Author_Institution :
Hughes Research Laboratories, Malibu, CA
Volume :
23
Issue :
6
fYear :
1987
fDate :
6/1/1987 12:00:00 AM
Firstpage :
948
Lastpage :
959
Abstract :
Long wavelength ( 1.3-1.55 \\mu m) diode lasers have exhibited an undesirably sensitive temperature dependence of threshold current, the so-called T0problem. Several mechanisms have been investigated as the source of this behavior, including carrier leakage and Auger recombination. We propose and demonstrate a new device, the p-DCC laser, which is grown by a three-melt LPE technique on p-type substrates. This diode exhibits a low threshold ( Jth = 2.6 kA/cm2for broad area devices) and high T0(180 K) since the p-DCC structure provides improved carrier confinement and cooling of hot carriers. Thresholds as low as 2.0 kA/cm2have been observed for devices with thin (∼ 500 Å) active and separation layers, but the T0has decreased to 106 K. It is evident that the p-DCC structure provides a device which is superior to a conventional DHL with a thicker active layer. We conjecture that leaky electrons, possibly generated by Auger recombination, are efficiently cooled by scattering processes as they diffuse through the separation layer and into the second active layer where they radiatively recombine. The devices have been modeled using the Purdue University Program for Heterostructure Simulation (PUPHS), and an attempt has been made to optimize the device parameters in order to attain low threshold, high T0lasers.
Keywords :
Epitaxial growth; Gallium materials/lasers; Laser thermal factors; Carrier confinement; Cooling; Diode lasers; Electrons; Hot carriers; Indium phosphide; Scattering; Spontaneous emission; Temperature dependence; Threshold current;
fLanguage :
English
Journal_Title :
Quantum Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9197
Type :
jour
DOI :
10.1109/JQE.1987.1073464
Filename :
1073464
Link To Document :
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