DocumentCode :
1114233
Title :
A fully planar heterojunction bipolar transistor
Author :
Tully, John W. ; Hant, W. ; O´Brien, B.B.
Author_Institution :
Northrop Research and Technology Center, Palos Verdes Peninsula, CA
Volume :
7
Issue :
11
fYear :
1986
fDate :
11/1/1986 12:00:00 AM
Firstpage :
615
Lastpage :
617
Abstract :
A fully planar heterojunction bipolar transistor (HBT) in the normal emitter-up configuration is reported. The process utilizes a two-step epitaxial deposition with an intervening selective ion implant of bases. A process is described, the aluminum lift-off (ALL) process, with which refractory metal contacts have been used. Large test devices fabricated have dc gains of β = 600.
Keywords :
Aluminum; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Implants; Inverters; Ion implantation; MOCVD; Resists; Sputter etching;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1986.26493
Filename :
1486316
Link To Document :
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