DocumentCode :
1114257
Title :
Si/SiGe heterojunction bipolar transistor made by molecular-beam epitaxy
Author :
Narozny, P. ; Dämbkes, H. ; Kibbel, H. ; Kasper, E.
Author_Institution :
Daimler Benz Res. Center, Ulm, West Germany
Volume :
36
Issue :
10
fYear :
1989
fDate :
10/1/1989 12:00:00 AM
Firstpage :
2363
Lastpage :
2366
Abstract :
Si/SiGe heterostructure bipolar transistors (HBTs) were fabricated and compared to Si homojunction transistors with similar doping levels. Low-temperature Si-MBE (molecular-beam epitaxy) was used to form the heterojunction and the homojunction layer sequences. A wet chemical selective etching technique was used to contact the thin (80 nm) base layer of the heterojunction transistor. A peak current gain of 200 to 400 was measured for the heterostructure devices, compared to a gain of two for the homojunction structure. The current gain collector current dependence of the heterostructure device could be due to surface recombination effects
Keywords :
Ge-Si alloys; elemental semiconductors; etching; heterojunction bipolar transistors; molecular beam epitaxial growth; semiconductor growth; silicon; HBTs; Si homojunction transistors; Si-SiGe; current gain collector current dependence; heterojunction bipolar transistor; molecular-beam epitaxy; peak current gain; surface recombination effects; wet chemical selective etching; Bipolar transistors; Chemicals; Current measurement; Doping; Gain measurement; Germanium silicon alloys; Heterojunction bipolar transistors; Molecular beam epitaxial growth; Silicon germanium; Wet etching;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.40923
Filename :
40923
Link To Document :
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