Title :
Metallic electromigration phenomena
Author :
Krumbein, Simeon J.
Author_Institution :
AMP Inc., Harrisburg, PA, USA
fDate :
3/1/1988 12:00:00 AM
Abstract :
Metallic electromigration can be defined as the movement of metallic material, usually through or across a nonmetallic medium, under the influence of an electric field. As such, it has assumed increasing importance in the performance and reliability of packaging systems that incorporate electric contacts. The characteristics of the different electromigration processes are discussed, including descriptions of related phenomena. The primary emphasis is on electrolytically controlled processes that take place under low power and typical ambient conditions
Keywords :
electrical contacts; electromigration; failure analysis; humidity; hybrid integrated circuits; monolithic integrated circuits; packaging; printed circuits; reliability; characteristics; electric contacts; electric field; electrolytically controlled processes; electromigration processes; failure modes; low power; metallic electromigration phenomena; movement of metallic material; packaging systems; related phenomena; reliability; typical ambient conditions; Conducting materials; Conductors; Contacts; Copper; Electromigration; Inorganic materials; Packaging; Power system reliability; Tin; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
