Metallic electromigration phenomena

Author

Krumbein, Simeon J.

Author_Institution

AMP Inc., Harrisburg, PA, USA

Volume

11

Issue

1

fYear

1988

fDate

3/1/1988 12:00:00 AM

Firstpage

5

Lastpage

15

Abstract

Metallic electromigration can be defined as the movement of metallic material, usually through or across a nonmetallic medium, under the influence of an electric field. As such, it has assumed increasing importance in the performance and reliability of packaging systems that incorporate electric contacts. The characteristics of the different electromigration processes are discussed, including descriptions of related phenomena. The primary emphasis is on electrolytically controlled processes that take place under low power and typical ambient conditions

Keywords

electrical contacts; electromigration; failure analysis; humidity; hybrid integrated circuits; monolithic integrated circuits; packaging; printed circuits; reliability; characteristics; electric contacts; electric field; electrolytically controlled processes; electromigration processes; failure modes; low power; metallic electromigration phenomena; movement of metallic material; packaging systems; related phenomena; reliability; typical ambient conditions; Conducting materials; Conductors; Contacts; Copper; Electromigration; Inorganic materials; Packaging; Power system reliability; Tin; Voltage;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.2957

Filename

2957