• DocumentCode
    1115290
  • Title

    Highly efficient manifold microchannel heatsink

  • Author

    Wang, Y. ; Ding, G.F. ; Fu, S.

  • Author_Institution
    Shanghai Jiao Tong Univ., Shanghai
  • Volume
    43
  • Issue
    18
  • fYear
    2007
  • Firstpage
    978
  • Lastpage
    980
  • Abstract
    A manifold microchannel heatsink with high local heat transfer efficiency is presented. CFX simulation indicates that the microchannel heatsink has higher heat transfer efficiency than the conventional structure. Infrared tests demonstrate the dependence of substrate steady-state temperature on flow rate, 0.64-6.7 ml/min, with heat flux of 104000 W/m2. Maximum heat flux input, 203000 W/m2, is obtained for 6.7 ml/min flow rate.
  • Keywords
    heat sinks; heat transfer; microchannel flow; CFX simulation; highly efficient manifold microchannel heatsink; local heat transfer; substrate steady-state temperature;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20071325
  • Filename
    4299476
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1115290