Title :
The effect of test environment on the creep of base metal surface films over precious metal inlays
Author :
Williams, David W M
Author_Institution :
Tech. Mater. Inc., Lincoln, RI, USA
fDate :
3/1/1988 12:00:00 AM
Abstract :
An evaluation of two precious-metal inlays, WE #1 (69Au25Ag6Pt) and diffused gold-palladium-silver, in combination with several base metals (C72500, C52100, C65400, C17200), which were exposed to a range of severe environments, is discussed. The materials were exposed as (a) bare coupons and (b) assembled connectors. The environmental exposures were carried out in a laboratory test chamber using Battelle Class II and III atmospheres, respectively. The chamber test periods simulated outdoor life exposures of 2-20 yr for Battelle Class II and 1-10 yr for Battelle Class III. Sample coupons and connectors are characterized by measurements of contact and low-level circuit resistance, respectively. The beneficial effects of a protective layer over copper alloys to prevent creep of corrosion products were demonstrated. Two methods, the use of a commercial lubricant and the shielding of a connector housing, were used to retard corrosive attack and creep
Keywords :
contact resistance; corrosion protection; corrosion testing; electric connectors; environmental testing; 1 to 20 y; AuAgPt; AuPdAg; Battelle Class II atmosphere; Battelle Class III atmosphere; C17200; C52100; C65400; C72500; assembled connectors; bare coupons; base metals; chamber test periods; commercial lubricant; contact resistance; corrosion testing; creep of base metal surface films; effect of test environment; environmental testing; laboratory test chamber; low-level circuit resistance; precious metal inlays; protective layer; sample coupons; severe environments; shielding; simulated outdoor life exposures; Assembly; Atmosphere; Atmospheric measurements; Atmospheric modeling; Circuit simulation; Circuit testing; Connectors; Creep; Electrical resistance measurement; Life testing;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on