DocumentCode :
1115752
Title :
Reproducibility of electromigration measurements
Author :
Schafft, Harry A. ; Staton, Tammy C. ; Mandel, J. ; Shott, John D.
Author_Institution :
National Bureau of Standards, Gaithersburg, MD
Volume :
34
Issue :
3
fYear :
1987
fDate :
3/1/1987 12:00:00 AM
Firstpage :
673
Lastpage :
681
Abstract :
The reproducibility of median-time-to-failure (t50) measurements was determined in an interlaboratory experiment in which 11 laboratories and a reference laboratory took part. Each laboratory used a method of its choosing to test equivalent samples under the same conditions of current density and oven temperature. The between-laboratory reproducibility of t50measurements normalized to one metallization temperature was dependent on current-density stress: at 1.0 MA /cm2it was within 15 percent, while at 2.5 MA/cm2it was generally within 50 percent. The primary source for variability is in estimating the temperature rise of the test metallization due to joule heating. Recommendations are given for the design and test of electromigration test structures to improve the reproducibility of t50measurements.
Keywords :
Current density; Current measurement; Electromigration; Laboratories; Metallization; Ovens; Reproducibility of results; Stress measurement; Temperature; Testing;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1987.22979
Filename :
1486690
Link To Document :
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