DocumentCode :
111615
Title :
Interface Trap-Induced Nonideality in As-Deposited Ni/4H-SiC Schottky Barrier Diode
Author :
Omar, Sabih Uddin ; Sudarshan, Tangali S. ; Rana, Tawhid A. ; Haizheng Song ; Chandrashekhar, M.V.S.
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
Volume :
62
Issue :
2
fYear :
2015
fDate :
Feb. 2015
Firstpage :
615
Lastpage :
621
Abstract :
As-deposited Ni/SiC Schottky diodes often show nonideal forward conduction characteristics. The ideality can be improved by the formation of a nickel-silicide/SiC interface by annealing at 650 °C. The nonideal characteristics in as-deposited diodes are generally attributed to Schottky barrier inhomogeneity at the interface. However, recent studies show that highly nonideal characteristics (n 1.2) cannot be explained by the existing inhomogeneity models. In this paper, we report the observation of hysteresis patterns in the I-V and CV characteristics of as-deposited nonideal diodes. It is argued that the existence of evenly distributed slow, donor-like interface traps can explain the hysteresis and the associated Schottky nonideality. A trap density of 108-1010 cm-2 was estimated from the I-V and CV hysteresis.
Keywords :
Schottky barriers; Schottky diodes; annealing; nickel; silicon compounds; wide band gap semiconductors; CV characteristics; I-V characteristics; Ni-SiC; Schottky barrier inhomogeneity; Schottky nonideality; annealing; as-deposited Ni-4H-SiC Schottky barrier diode; as-deposited diodes; as-deposited nonideal diodes; donor-like interface traps; forward conduction; hysteresis patterns; interface trap induced nonideality; nickel-silicide-SiC interface; temperature 650 degC; Annealing; Hysteresis; Nickel; Schottky barriers; Schottky diodes; Thyristors; Barrier height; Schottky diode; interface trap; metal--semiconductor junction; metal-semiconductor junction; silicon carbide; silicon carbide.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2383386
Filename :
6999928
Link To Document :
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