• DocumentCode
    1116879
  • Title

    Device isolation in high-density LOCOS-isolated CMOS

  • Author

    Lewis, Alan G. ; Chen, John Y. ; Martin, Russel A. ; Huang, Tiao-Yuan

  • Author_Institution
    Xerox Palo Alto Research Center, Palo Alto, CA
  • Volume
    34
  • Issue
    6
  • fYear
    1987
  • fDate
    6/1/1987 12:00:00 AM
  • Firstpage
    1337
  • Lastpage
    1345
  • Abstract
    Leakage paths between n- and p-channel devices in high packing density CMOS circuits fabricated using standard LOCOS isolation are investigated. Experimental results and the results of two-dimensional numerical modeling are presented for both a conventional n-well and a retrograde n-well technology. Adequate isolation for 5-V circuit operation is demonstrated for retrograde n-well structures with a 1.8-µm n+to p+diffusion separation, and for conventional n-well structures with a 2.4-µm n+to p+diffusion separation. In both cases, good latchup protection is also demonstrated using thin p-on p+epitaxial material.
  • Keywords
    Aluminum; Boron; CMOS technology; Circuits; Implants; Isolation technology; Oxidation; Semiconductor device modeling; Substrates; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1987.23089
  • Filename
    1486800