DocumentCode
1116879
Title
Device isolation in high-density LOCOS-isolated CMOS
Author
Lewis, Alan G. ; Chen, John Y. ; Martin, Russel A. ; Huang, Tiao-Yuan
Author_Institution
Xerox Palo Alto Research Center, Palo Alto, CA
Volume
34
Issue
6
fYear
1987
fDate
6/1/1987 12:00:00 AM
Firstpage
1337
Lastpage
1345
Abstract
Leakage paths between n- and p-channel devices in high packing density CMOS circuits fabricated using standard LOCOS isolation are investigated. Experimental results and the results of two-dimensional numerical modeling are presented for both a conventional n-well and a retrograde n-well technology. Adequate isolation for 5-V circuit operation is demonstrated for retrograde n-well structures with a 1.8-µm n+to p+diffusion separation, and for conventional n-well structures with a 2.4-µm n+to p+diffusion separation. In both cases, good latchup protection is also demonstrated using thin p-on p+epitaxial material.
Keywords
Aluminum; Boron; CMOS technology; Circuits; Implants; Isolation technology; Oxidation; Semiconductor device modeling; Substrates; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1987.23089
Filename
1486800
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