DocumentCode :
1116950
Title :
Specific contact resistivity measurement by a vertical Kelvin test structure
Author :
Lei, Tan Fu ; Leu, Len Yi ; Lee, Chung Len
Author_Institution :
National Chiao Tung University, Hsin Chu, Taiwan, Republic of China
Volume :
34
Issue :
6
fYear :
1987
fDate :
6/1/1987 12:00:00 AM
Firstpage :
1390
Lastpage :
1395
Abstract :
A vertical Kelvin test structure is used to measure the specific contact resistivity of the Al (1-percent Si)/Si and Al (1-percent Si)/TiSi2/Si contact system. For the vertical test structure, the driving current flows "vertically," thus the current crowdings and sheet resistance effects are eliminated and measurement on the true specific contact resistivity becomes possible. Experimental works show that results obtained by using this vertical structure are closer to the true specific contact resistivities than those obtained by using the conventional six-terminal Kelvin method. It is also found that Rsd, the sheet resistance directly underneath the contact pad, is much less than that of the conduction bar without the contact pad. A value of (1.17 ± 0.17) × 10-7Ω . cm2specific contact resistivity is obtained for the Al (1-percent Si) /TiSi2(direct reaction) /Si system.
Keywords :
Conductivity measurement; Contact resistance; Current measurement; Electrical resistance measurement; Kelvin; Metallization; Proximity effect; Semiconductor devices; System testing; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1987.23096
Filename :
1486807
Link To Document :
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