DocumentCode
1116969
Title
Interfacial and breakdown characteristics of MOS devices with rapidly grown ultrathin SiO2 gate insulators
Author
Moslehi, Mehrdad M. ; Shatas, Steven C. ; Saraswat, Krishna C. ; Meindl, James D.
Author_Institution
Stanford University, Stanford, CA
Volume
34
Issue
6
fYear
1987
fDate
6/1/1987 12:00:00 AM
Firstpage
1407
Lastpage
1410
Abstract
Metal-oxide-semiconductor (MOS) devices fabricated with composite gates and subhundred-angstrom SiO2 gate insulators grown by rapid thermal oxidation were characterized by various electrical measurements. The as-fabricated devices with unannealed rapidly grown oxides exhibited breakdown characteristics superior to furnace-grown oxides as evidenced by their excellent breakdown uniformity, an average breakdown field of 15 MV/cm, and an average breakdown charge density of over 50 C/cm2at a stress current density of 1 A/cm2. The preoxidation surface cleaning procedure was observed to affect the charge-to-breakdown and the densities of fixed oxide charges and surface states in these MOS structures.
Keywords
Dielectrics and electrical insulation; Electric breakdown; Ellipsometry; Hafnium; MOS devices; Oxidation; Rapid thermal processing; Silicon; Surface cleaning; Temperature control;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1987.23098
Filename
1486809
Link To Document