Nonplanar multiple-epitaxy bipolar power integrated-circuit process

The market need to merge digital, analog, and power components on a common monolithic substrate in a cost-effective manner continues to grow in importance in many applications. This paper describes a nonplanar multiple-epitaxy bipolar power integrated-cir-Cuit process that is particularly well-suited for low-cost power applications such as series-pass voltage regulators. The concept enhances transistor characteristics and can be extended to more complex, higher performance intelligent power IC applications.