The tradeoff between peripheral and area array bonding of components in multichip modules

This paper examines the tradeoff between peripheral I/O format die (for wirebonding, tape automated bonding (TAB), or peripheral flip chip bonding) and area array I/O format die (for flip chip bonding), as a function of partitioning a fixed functionality into a variable number of die. The comparison in this study has been made in the context of a multichip module (MCM). The analysis approach used concurrently considers module size, thermal and electrical performance, and cost (including module-level test and rework) to assess the overall applicability of one bonding format over the other