Title :
Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies
Author :
Iqbal, Asif ; Swaminathan, Madhavan ; Nealon, Michael ; Omer, Ahmed
Author_Institution :
Amdahl Corp., Fremont, CA, USA
fDate :
2/1/1994 12:00:00 AM
Abstract :
The paper describes tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies. The thin and thick film interconnection media are compared with their associated pros and cons in terms of performance and cost
Keywords :
integrated circuit technology; multichip modules; simulation; thick film circuits; thin film circuits; MCM-C technology; MCM-D technology; MCM-D/C technology; cost; design tradeoffs; electrical performance; thick film interconnection; thin film interconnection; wiring density; Cost function; Design optimization; Packaging machines; Paper technology; Power system reliability; Semiconductor device packaging; Signal design; Substrates; Transistors; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
