• DocumentCode
    1119302
  • Title

    Evaluation of flux-based logic schemes for high-Tc applications

  • Author

    Fleischman, Jay ; Feld, David ; Xiao, Peter ; Van Duzer, Theodore

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • Volume
    27
  • Issue
    2
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    2769
  • Lastpage
    2772
  • Abstract
    Three digital logic families that can be made using nonhysteretic Josephson junctions (potentially the only kind of Josephson device realizable with superconductors having high transition temperatures) are analyzed. These logic families utilize magnetic flux-transfer, and are characterized by very low power dissipation. Rapid single flux quantum (RSFQ) and phase-mode logic are both based on pulse propagation. The quantum flux parametron (QFP) logic family is based on current latching. Simulations of RSFQ, Phase-Mode, and QFP logic families using high-T c junction parameters are presented to demonstrate the compatibility of these logic families with the perovskite superconductors. The operation of these logic families is analyzed, and the advantages and disadvantages of each are discussed
  • Keywords
    high-temperature superconductors; superconducting logic circuits; QFP; RSFQ; current latching; digital logic families; flux-based logic schemes; high temperature superconductors; high-Tc junction parameters; low power dissipation; magnetic flux-transfer; nonhysteretic Josephson junctions; operation; perovskite superconductors; phase-mode logic; pulse propagation; quantum flux parametron; rapid single flux quantum; Electronics packaging; High temperature superconductors; Josephson junctions; Logic devices; Magnetic analysis; Magnetic flux; Power dissipation; Superconducting devices; Superconducting magnets; Superconducting transition temperature;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.133785
  • Filename
    133785