DocumentCode :
1120367
Title :
Time-dependent degradation of thin gate oxide under post-oxidation high-temperature anneal
Author :
Lassig, S. ; Liang, M.S.
Author_Institution :
Peak Systems Inc., Fremont, CA
Volume :
8
Issue :
4
fYear :
1987
fDate :
4/1/1987 12:00:00 AM
Firstpage :
160
Lastpage :
161
Abstract :
Charge to breakdown QBDhas been used to evaluate the quality of thin gate oxides for some time. It is well known that the QBDof a thin oxide degrades with subsequent high-temperature thermal cycles. This paper reports on the time-dependent degradation of an 80-Å gate oxide at various post-oxidation annealing temperatures. An empirical relation was obtained as Q_{BD} \\propto \\exp (-A(T)t) where t is annealing time, T is annealing temperature, and A is the "rate constant" for the QBDdegradation. An Arrhenius plot of A versus 1/T yields an activation energy in the range of 6-7 eV. Also reported is the observation of an increase in QBDduring short annealing time which may be related to the relaxation of built-in stress induced during the oxidation process.
Keywords :
Annealing; Breakdown voltage; Current density; Design for quality; Monitoring; Oxidation; Solids; Temperature; Thermal degradation; Thermal stresses;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1987.26587
Filename :
1487137
Link To Document :
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