Title :
Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound
Author :
Konzelmann, Simon ; Hoffmann, Christian ; Merte, Ralf ; Peier, Dirk
Author_Institution :
Univ. of Dortmund, Dortmund
fDate :
4/1/2008 12:00:00 AM
Abstract :
Epoxy resin compounds are manufactured with silica glass and aluminum nitride as filling material at various filling ratios. The thermal conductivity and electrical properties, like dielectric loss or electric strength, are measured and compared as regards to an utilization as electrical insulator.
Keywords :
aluminium compounds; dielectric losses; electric strength; filled polymers; glass; silicon compounds; thermal conductivity; dielectric loss; electric strength; electrical properties; epoxy resin compounds; filling material; glass; thermal conductivity; Aluminum nitride; Conducting materials; Dielectric loss measurement; Dielectric losses; Dielectric materials; Epoxy resins; Filling; Glass manufacturing; Silicon compounds; Thermal conductivity;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2008.4483449
