Title :
With other acoustical and audio societies
Author_Institution :
IEEE IRETAU
Abstract :
Provides a notice of upcoming events of interest to practitioners and researchers.
Keywords :
Acoustical engineering; Damping; Electric shock; Electronics packaging; Frequency; Low-frequency noise; Manufacturing; Motion analysis; Noise level; Production systems;
Journal_Title :
Audio, IRE Transactions on
DOI :
10.1109/TAU.1958.1166119
