Low dielectric constant multilayer glass-ceramic substrate with Ag-Pd wiring for VLSI package

Glass-ceramic materials with low dielectric constant, which can be sintered at about 900° in air, have been developed. Conductors with extremely low electrical resistivity due to silver and palladium particle shape control have been obtained. The electrical design must be considered for the packaging substrate. Pulse transmission properties are influenced greatly by the kinds of ground planes and wiring planes used. Therefore, basic pulse-transmission properties, such as propagation delay, characteristic impedance, and crosstalk coupling noise, were measured for various multilayer structures. Technologies that allow precise control of substrate properties have been established. Characteristics for the multilayer glass-ceramic (MGC) substrate are summarized. It is shown that the low-dielectric-constant MGC substrate, with silver-palladium conductors, can be applied to VLSI multichip packaging substrate for use in large-scale computer systems