Title :
SubCM: a tool for improved visibility of software change in an industrial setting
Author :
Völzer, Hagen ; MacDonald, Anthony ; Atchison, Brenton ; Hanlon, Andrew ; Lindsay, Peter ; Strooper, Paul
Author_Institution :
Lubeck Univ., Germany
Abstract :
Software configuration management is the discipline of managing large collections of software development artefacts from which software products are built. Software configuration management tools typically deal with artefacts at fine levels of granularity - such as individual source code files - and assist with coordination of changes to such artefacts. This paper describes a lightweight tool, designed to be used on top of a traditional file-based configuration management system. The add-on tool support enables users to flexibly define new hierarchical views of product structure, independent of the underlying artefact-repository structure. The tool extracts configuration and change data with respect to the user-defined hierarchy, leading to improved visibility of how individual subsystems have changed. The approach yields a range of new capabilities for build managers, and verification and validation teams. The paper includes a description of our experience using the tool in an organization that builds large embedded software systems.
Keywords :
configuration management; embedded systems; formal verification; software maintenance; software tools; add-on tool support; artefact-repository structure; embedded software systems; file-based configuration management system; software change; software configuration management; software development artefacts; software maintenance; software products; software verification; source code files; Australia; Computational Intelligence Society; Computer industry; Data mining; Programming; Project management; Software development management; Software maintenance; Software tools; Testing; 65; Index Terms- Software configuration management; software maintenance; verification and validation.;
Journal_Title :
Software Engineering, IEEE Transactions on
DOI :
10.1109/TSE.2004.67