• DocumentCode
    1122941
  • Title

    Improved performance of Si-based spiral inductors

  • Author

    Chen, Tung-Sheng ; Deng, J.D.-S. ; Lee, Chih-Yuan ; Kao, Chin-Hsing

  • Author_Institution
    Dept. of Electr. Eng., Nat. Defense Univ., Taiwan, Taiwan
  • Volume
    14
  • Issue
    10
  • fYear
    2004
  • Firstpage
    466
  • Lastpage
    468
  • Abstract
    Conventional spiral inductors on silicon wafer have suffered low quality (Q) factor due to substrate loss. In this work, a technique that combines optimized shielding poly and proton implantation treatment is utilized to improve inductor Q-value. The optimized poly-silicon and proton-bombarded substrate have added 37% and 54% increment to the Q-value of inductors, respectively. If two techniques are combined, a phenomenal Q-value increment as high as 122% of 4-nH spiral inductors can be realized. The combination of the two means has created a multiplication of their individual contribution rather than addition. The technique used in this work shall become a critical measure to put inductors on silicon substrate with satisfactory performance for Si-based radio frequency integrated circuit applications.
  • Keywords
    Q-factor; elemental semiconductors; inductors; radiofrequency integrated circuits; shielding; silicon; silicon-on-insulator; inductor Q-value; optimized shielding; poly implantation treatment; proton implantation treatment; radio frequency integrated circuit applications; shielding poly; silicon substrate; silicon-on-insulator; spiral inductors; Electromagnetic scattering; Electromagnetic transients; Implants; Inductors; Protons; Radio frequency; Radiofrequency integrated circuits; Silicon on insulator technology; Spirals; Substrates; Proton implant; Q-value; RFIC; SOI; radio frequency integrated circuit; shielding poly; silicon-on-insulator; spiral inductor;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2004.834552
  • Filename
    1339293