Title :
Closed-Form RC and RLC Delay Models Considering Input Rise Time
Author :
Kim, SoYoung ; Wong, S. Simon
Author_Institution :
Stanford Unv., Stanford
Abstract :
The Elmore delay model is the most popular and efficient delay model used for analytical delay estimation. Closed-form delay formulas are useful for circuit design, timing-driven physical design, synthesis, and optimization. As signal rise time becomes faster and the line resistance becomes smaller from copper technology, the significance of inductance increases. Both RC and RLC delays are a strong function of signal rise time. We propose a novel and efficient delay modeling method based on nondimensionalization to consider finite input rise time as an improvement over the Elmore´s approach. To further improve the accuracy of the delay model, a new correction method, effective distance correction factor (EDCF), is proposed to consider resistive shielding of downstream capacitance. EDCF can be used to correct the delays for both RC and RLC tree structures. The proposed delay modeling method was applied to a number of nets selected from an integrated circuit (IC) design, and the delay estimation results were compared with HSPICE simulations. The new delay model retains the efficiency and simplicity of the Elmore delay model with significantly improved accuracy.
Keywords :
RC circuits; RLC circuits; delay estimation; integrated circuit design; Elmore delay model; RLC delay model; analytical delay estimation; circuit optimization; circuit synthesis; closed-form RC delay model; closed-form delay formulas; downstream capacitance; effective distance correction factor; input rise time; integrated circuit design; timing-driven physical design; Analytical models; Capacitance; Circuit synthesis; Copper; Delay effects; Delay estimation; Design optimization; Inductance; Integrated circuit modeling; Signal synthesis; Delay model; inductance; interconnect; ramp input; resistive shielding;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2007.902539