• DocumentCode
    1125185
  • Title

    Surface electrostatic damage by microprocess robotic machines: diagnosis and reliability, process auditing, and remedies

  • Author

    Jacob, Peter ; Nicoletti, Giovanni

  • Author_Institution
    Dept. of Electron./Metrol., Empa Swiss Fed. Labs. for Mater. Testing & Res., Duebendorf
  • Volume
    6
  • Issue
    2
  • fYear
    2006
  • fDate
    6/1/2006 12:00:00 AM
  • Firstpage
    213
  • Lastpage
    220
  • Abstract
    Electrostatic discharge (ESD) is generally known as a discharge phenomena via device pins. Many precautions have been taken against ESD, mostly considering workplace protection, pad protection structures. However, electrostatic events, originating from robotic semiconductor wafer- and device-processing seems at least a problem of similar severeness, which has not been considered enough, yet. This paper describes electrostatic mechanisms in most common assembly process tools, how to do diagnostics on devices and tool auditing. Auditing experiences are listed and hints how to improve tool-related ESD are described
  • Keywords
    assembling; electrostatic discharge; semiconductor device manufacture; semiconductor device reliability; assembly process tools; device pins; device-processing; electrostatic discharge; electrostatic mechanisms; microprocess robotic machines; pad protection structures; process auditing; robotic semiconductor wafer; semiconductor device fabrication; surface electrostatic damage; workplace protection; Assembly; Electrostatic discharge; Employment; Head; Liquid crystal devices; Optical microscopy; Passivation; Protection; Robots; Testing; Assembly systems; electrostatic discharge (ESD); semiconductor device fabrication;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2006.877863
  • Filename
    1673713