• DocumentCode
    112647
  • Title

    Drain E-Field Manipulation in AlGaN/GaN HEMTs by Schottky Extension Technology

  • Author

    Yi-Wei Lian ; Yu-Syuan Lin ; Hou-Cheng Lu ; Yen-Chieh Huang ; Hsu, Shawn S. H.

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    62
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    519
  • Lastpage
    524
  • Abstract
    The proposed hybrid Schottky-ohmic drain structure is analyzed in detail for AlGaN/GaN power high-electron mobility transistors on the Si substrate. Without any additional photomasks and process steps, the hybrid drain design can alter the electric field distribution to improve the breakdown voltage VBK. In addition, it provides an additional current path to achieve zero onset voltage and reduce the ON-resistance. It was found that the Schottky extension Lext is critical to VBK, RON, and also the current collapse phenomena of the transistors. The extended Schottky electrodes for optimized transistor characteristics are investigated, and the physics behind are discussed. With an Lext ~ 2-3 μm, VBK can be improved up to 60% with an RON degradation below 3%.
  • Keywords
    III-V semiconductors; Schottky barriers; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; wide band gap semiconductors; AlGaN-GaN; HEMTs; Schottky extension technology; breakdown voltage; current collapse phenomena; drain E-field manipulation; electric field distribution; extended Schottky electrodes; high-electron mobility transistors; hybrid Schottky-ohmic drain structure; optimized transistor characteristics; zero onset voltage; Aluminum gallium nitride; Electrodes; Gallium nitride; HEMTs; Logic gates; MODFETs; Breakdown voltage; GaN-on-Si; Schottky contact; Schottky contact.; high-electron mobility transistor (HEMT); leakage current;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2382558
  • Filename
    7001057