DocumentCode
1127227
Title
Proposed ultrahigh frequency microstrip utilising buried silicide groundplane
Author
Goosen, K.W. ; White, A.E. ; Short, K.T.
Author_Institution
AT&T Bell Labs., Holmdel, NJ, USA
Volume
26
Issue
1
fYear
1990
Firstpage
49
Lastpage
50
Abstract
Recently it has become possible to produce buried single-crystal silicide layers in silicon on which epitaxial silicon may be grown. The authors show that if such a layer is used as a groundplane in a microstrip configuration, ultra-high-speed signals (e.g. 100 GHz) can be propagated with far less dispersion than on standard microstrip, by virtue of the close proximity of the groundplane to the centre conductor.
Keywords
MMIC; digital integrated circuits; integrated circuit technology; microwave integrated circuits; strip line components; strip lines; 100 GHz; IC interconnect; MMIC; buried silicide groundplane; microstrip; microwave IC; ultra-high-speed signals;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19900032
Filename
44868
Link To Document