• DocumentCode
    1127227
  • Title

    Proposed ultrahigh frequency microstrip utilising buried silicide groundplane

  • Author

    Goosen, K.W. ; White, A.E. ; Short, K.T.

  • Author_Institution
    AT&T Bell Labs., Holmdel, NJ, USA
  • Volume
    26
  • Issue
    1
  • fYear
    1990
  • Firstpage
    49
  • Lastpage
    50
  • Abstract
    Recently it has become possible to produce buried single-crystal silicide layers in silicon on which epitaxial silicon may be grown. The authors show that if such a layer is used as a groundplane in a microstrip configuration, ultra-high-speed signals (e.g. 100 GHz) can be propagated with far less dispersion than on standard microstrip, by virtue of the close proximity of the groundplane to the centre conductor.
  • Keywords
    MMIC; digital integrated circuits; integrated circuit technology; microwave integrated circuits; strip line components; strip lines; 100 GHz; IC interconnect; MMIC; buried silicide groundplane; microstrip; microwave IC; ultra-high-speed signals;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19900032
  • Filename
    44868