• DocumentCode
    1128312
  • Title

    Adaptive tip-withdrawal control for reliable microfabrication by localized electrodeposition

  • Author

    Said, Ra´a A.

  • Author_Institution
    Electr. Eng. Dept., United Arab Emirates Univ., Abo-Dhabi, United Arab Emirates
  • Volume
    13
  • Issue
    5
  • fYear
    2004
  • Firstpage
    822
  • Lastpage
    832
  • Abstract
    The electrode tip withdrawal velocity relative to the deposit surface growth rate is found to play a major role in process repeatability, deposit characteristics, and geometry confinement of high aspect ratio microstructures fabricated by localized electrodeposition. The effect of the tip and deposit-surface relative velocities is understood through experimental investigation of deposit characteristics for the three possible cases where the tip withdrawal is; slower than, relatively equal to, and faster than the deposition rate. Best results were obtained when the tip withdrawal is relatively of the same magnitude of the deposition rate. For automation purposes, an adaptive control scheme is proposed to track the deposit surface acceleration, rather than its velocity, by monitoring the tip current gradient, and accordingly withdraw the tip at the same acceleration. This eliminates the need for the intervention of a skilful experimenter, avoids short circuit contact resulting between the tip and deposit surface, and thus greatly improves the repeatability of the process. Critically important to the proposed adaptive tip-withdrawal technique is the initial approach of the tip toward the substrate to assure proper tracking of deposition current. Automation and optimization of the initial tip positioning above the substrate is achieved by tracking deposition current variation with the tip-substrate spacing, thus leading to a better geometry confinement of deposited structures.
  • Keywords
    adaptive control; copper; electrodeposition; micromechanical devices; substrates; adaptive control scheme; adaptive tip-withdrawal control; adaptive tip-withdrawal technique; automation purposes; copper deposition; deposit characteristics; deposit surface acceleration; deposit surface growth rate; deposition current; deposition rate; electrochemical deposition; electrode tip withdrawal velocity; geometry confinement; high aspect ratio microstructures; localized electrodeposition; process repeatability; progressive boundary update method; reliable microfabrication; shape evolution; shape formation; short circuit contact avoidance; tip current gradient; tip-substrate spacing; Acceleration; Adaptive control; Automation; Computerized monitoring; Electrodes; Fabrication; Geometry; Light emitting diodes; Microstructure; Programmable control; Copper deposition; electrochemical deposition; localized deposition; microstructures; progressive boundary update method; shape formation/evolution;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2004.835774
  • Filename
    1341458