DocumentCode :
1128751
Title :
Analysis of electromagnetic coupling through a thick aperture in multilayer planar circuits using the extended spectral domain approach and finite difference time-domain method
Author :
Tran, Allen M. ; Houshmand, Bijan ; Itoh, Tatsuo
Author_Institution :
Radar & Commun. Sector, Hughes Aircraft Co., El Segundo, CA, USA
Volume :
43
Issue :
9
fYear :
1995
fDate :
9/1/1995 12:00:00 AM
Firstpage :
921
Lastpage :
926
Abstract :
Electromagnetic coupling plays a very important role in the design and development of integrated antenna arrays and microwave circuits. With the availability of accurate computer-aided design tools, proper characterization and analysis, this coupling phenomenon could be used to simplify the packaging and fabrication process, to reduce manufacturing cost, and also to add flexibility to the design of multilayer structures in many cases. An accurate and efficient spectral domain approach (SDA) is proposed as a means to study the coupling effect through an arbitrary aperture in a thick common ground plane of multilayer planar circuits. In addition, the finite difference time domain (FDTD) method is present as an alternate approach to this type of problem and also is used as a validation tool for the spectral domain method because of its simplicity, generality, and accuracy. The proposed methods are applied to different aperture coupled structures for illustration
Keywords :
MMIC; antenna theory; finite difference time-domain analysis; microstrip antenna arrays; microstrip lines; spectral-domain analysis; transmission line theory; 2 to 10 GHz; SHF; UHF; computer-aided design; electromagnetic coupling; extended spectral domain approach; fabrication process; finite difference time-domain method; integrated antenna arrays; microwave circuits; multilayer planar circuits; multilayer structures; packaging; thick aperture; Apertures; Availability; Coupling circuits; Design automation; Electromagnetic analysis; Electromagnetic coupling; Finite difference methods; Microwave antenna arrays; Nonhomogeneous media; Packaging;
fLanguage :
English
Journal_Title :
Antennas and Propagation, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-926X
Type :
jour
DOI :
10.1109/8.410201
Filename :
410201
Link To Document :
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