• DocumentCode
    1129921
  • Title

    Design and Fabrication of a Novel Bimorph Microoptomechanical Sensor

  • Author

    Lim, Si-Hyung ; Choi, Jongeun ; Horowitz, Roberto ; Majumdar, Arunava

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
  • Volume
    14
  • Issue
    4
  • fYear
    2005
  • Firstpage
    683
  • Lastpage
    690
  • Abstract
    We have designed a so-called flip-over bimaterial (FOB) beam to increase the sensitivity of micromechanical structures for sensing temperature and surface stress changes. The FOB beam has a configuration such that a material layer coats the top and bottom of the second material at different regions along the beam length. By multiple interconnections of FOB beams, the deflection or sensitivity can be amplified, and the out-of-plane motion of a sensing structure can be achieved. The FOB beam has 53% higher thermomechanical sensitivity than a conventional one. Using the FOB beam design, we have developed a microoptomechanical sensor having a symmetric structure such that beam deflection is converted into a linear displacement of a reflecting surface, which is used for optical interferometry. The designed sensor has been fabricated by surface micromachining techniques using a transparent quartz substrate for optical measurement. Within a sensor area of 100 \\mu m \\times , 100 \\mu m , the thermomechanical sensitivity S_T = 180~ nm/ K was experimentally obtained. \\hfill \\hbox {[1403]}
  • Keywords
    light interferometry; micro-optics; micromachining; microsensors; quartz; stress measurement; temperature sensors; 100 micron; beam deflection; bimorph microoptomechanical sensor; flip-over bimaterial beam; multiple interconnections; optical interferometry; optical measurement; out-of-plane motion; quartz substrate; surface micromachining; surface stress sensing; temperature sensing; thermomechanical sensitivity; Fabrication; Micromachining; Micromechanical devices; Optical design; Optical design techniques; Optical interferometry; Optical sensors; Stress; Temperature sensors; Thermomechanical processes; Flip-over bimaterial (FOB) beam; interferometry; out-of-plane motion; quartz substrate; surface micromachining; surface stress sensing; temperature sensing; thermomechanical sensitivity;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2005.845446
  • Filename
    1492419