DocumentCode
1129921
Title
Design and Fabrication of a Novel Bimorph Microoptomechanical Sensor
Author
Lim, Si-Hyung ; Choi, Jongeun ; Horowitz, Roberto ; Majumdar, Arunava
Author_Institution
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
Volume
14
Issue
4
fYear
2005
Firstpage
683
Lastpage
690
Abstract
We have designed a so-called flip-over bimaterial (FOB) beam to increase the sensitivity of micromechanical structures for sensing temperature and surface stress changes. The FOB beam has a configuration such that a material layer coats the top and bottom of the second material at different regions along the beam length. By multiple interconnections of FOB beams, the deflection or sensitivity can be amplified, and the out-of-plane motion of a sensing structure can be achieved. The FOB beam has 53% higher thermomechanical sensitivity than a conventional one. Using the FOB beam design, we have developed a microoptomechanical sensor having a symmetric structure such that beam deflection is converted into a linear displacement of a reflecting surface, which is used for optical interferometry. The designed sensor has been fabricated by surface micromachining techniques using a transparent quartz substrate for optical measurement. Within a sensor area of 100
100
, the thermomechanical sensitivity
was experimentally obtained. ![\\hfill \\hbox {[1403]}](/images/tex/14963.gif)
100
, the thermomechanical sensitivity
was experimentally obtained. ![\\hfill \\hbox {[1403]}](/images/tex/14963.gif)
Keywords
light interferometry; micro-optics; micromachining; microsensors; quartz; stress measurement; temperature sensors; 100 micron; beam deflection; bimorph microoptomechanical sensor; flip-over bimaterial beam; multiple interconnections; optical interferometry; optical measurement; out-of-plane motion; quartz substrate; surface micromachining; surface stress sensing; temperature sensing; thermomechanical sensitivity; Fabrication; Micromachining; Micromechanical devices; Optical design; Optical design techniques; Optical interferometry; Optical sensors; Stress; Temperature sensors; Thermomechanical processes; Flip-over bimaterial (FOB) beam; interferometry; out-of-plane motion; quartz substrate; surface micromachining; surface stress sensing; temperature sensing; thermomechanical sensitivity;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2005.845446
Filename
1492419
Link To Document