The evolution of packages for monolithic microwave and millimeter-wave circuits

Author

Midford, Thomas A. ; Wooldridge, John J. ; Sturdivant, Rich L.

Author_Institution

Microwave Electron. Div., GM Hughes Electron., Los Angeles, CA, USA

Volume

43

Issue

9

fYear

1995

fDate

9/1/1995 12:00:00 AM

Firstpage

983

Lastpage

991

Abstract

The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As-a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas

Keywords

MIMIC; MMIC; active antenna arrays; antenna phased arrays; integrated circuit packaging; microwave antenna arrays; military equipment; millimetre wave antenna arrays; phased array radar; radar antennas; MMIC chips; MMIC technology; MMIC-based components; RF components; RF subsystems; active array antennas; active phased array radar; assembly technologies; commercial applications; cost; microwave packaging; military applications; millimeter-wave integrated circuits; millimeter-wave packaging; monolithic microwave integrated circuits; packaging; performance; size; weight; Application specific integrated circuits; Assembly; Defense industry; Integrated circuit packaging; Integrated circuit technology; MMICs; Microwave antenna arrays; Microwave integrated circuits; Microwave technology; Monolithic integrated circuits;

fLanguage

English

Journal_Title

Antennas and Propagation, IEEE Transactions on

Publisher

ieee

ISSN

0018-926X

Type

jour

DOI

10.1109/8.410215

Filename

410215