Title :
A thermal signal generator probe for the study of neural thermal transduction
Author :
Maluf, Nadim I. ; McNutt, Erin L. ; Monroe, Scott ; Tanelian, Darrell L. ; Kovacs, Gregory T A
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
fDate :
7/1/1994 12:00:00 AM
Abstract :
The study of thermal transduction in neural tissues has been impeded by the lack of instrumentation able to generate complex, focal temperature variations. Specifically, the authors are interested in the study of neural thermal transduction within the cornea, with its homogeneous thermal conductivity and avascularity. They present a thermal signal generator probe that is capable of producing arbitrarily shaped bipolar (heating or cooling) thermal swings in a small volume of corneal tissue with which it is in contact. Heating and cooling of the probe tip are achieved by means of a Peltier effect thermoelectric device. The probe temperature, measured directly at the tip, is controlled using closed-loop control circuitry and waveform generation software on a host computer. Response characteristics of thermally sensitive C-fibers were investigated in an in vitro preparation of the rabbit cornea.
Keywords :
biological techniques and instruments; biothermics; neurophysiology; probes; signal generators; C; Peltier effect thermoelectric device; arbitrarily shaped bipolar thermal swings; closed-loop control circuitry; complex focal temperature variations generation; cooling; heating; in vitro preparation; neural thermal transduction; neural tissues; rabbit cornea; thermal signal generator probe; thermally sensitive C-fibers; waveform generation software; Cooling; Cornea; Heating; Impedance; Instruments; Probes; Signal generators; Temperature control; Temperature measurement; Thermal conductivity; Action Potentials; Adaptation, Physiological; Animals; Body Temperature; Calibration; Cornea; Equipment Design; Nerve Tissue; Rabbits; Signal Processing, Computer-Assisted; Thermal Conductivity; Thermometers;
Journal_Title :
Biomedical Engineering, IEEE Transactions on