Title :
A novel method for fabrication of a hybrid optoelectronic packaging platform utilizing passive-active alignment
Author :
Datta, Madhumita ; Hu, Zhaoyang ; Dagenais, Mario
Author_Institution :
Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
Abstract :
We present a novel fabrication method for a hybrid optoelectronic packaging platform using a combination of passive and active alignment. V-grooves on a silicon optical bench facilitate coarse passive alignment, while on-board thin-film heaters enable final active alignment. The passive-active alignment technique ensures /spl sim/50% peak-coupling efficiency from a semiconductor laser diode with a single-mode conically lensed fiber, making it a low-cost packaging solution appropriate for a variety of optoelectronic modules.
Keywords :
heating elements; hybrid integrated circuits; integrated optoelectronics; optical fabrication; optical fibre couplers; semiconductor device packaging; V-grooves; coarse passive alignment; fabrication method; final active alignment; hybrid optoelectronic packaging platform; on-board thin-film heaters; passive-active alignment; peak-coupling efficiency; semiconductor laser diode; silicon optical bench; single-mode conically lensed fiber; Optical coupling; Optical device fabrication; Optical fiber devices; Optical fibers; Optical films; Optical interferometry; Optical wavelength conversion; Semiconductor device packaging; Semiconductor thin films; Silicon;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2002.806090
