DocumentCode :
1130779
Title :
Design and Validation of a Power Supply Noise Reduction Technique
Author :
Ji, Gang ; Arabi, Tawfik R. ; Taylor, Greg
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Volume :
28
Issue :
3
fYear :
2005
Firstpage :
445
Lastpage :
448
Abstract :
For the high-performance microprocessors with high-bandwidth I/O, the power supply noise needs to be controlled to ensure reliable high speed bus operation. This is generally done with high-quality package capacitors. These capacitors are generally lower equivalent series inductance (ESL) and lower equivalent series resistor (ESR). In this paper, we will present two implementations of an approach of using on-die resistors in series with the package capacitance to dampen the high-frequency noise. We will show by validation on the 90-nm technology that this technique is capable of reducing the noise by nearly 80% without adversely affecting the timings. The results of several validation experiments, including the measurement of noise and impedance of the I/O power delivery, and the post-layout simulation will also be presented.
Keywords :
capacitors; chip scale packaging; electric noise measurement; integrated circuit noise; microprocessor chips; power supply circuits; resistors; 90 nm; I/O power delivery; equivalent series inductance; equivalent series resistor; high speed bus operation; high-frequency noise; high-performance microprocessors; high-quality package capacitors; impedance measurement; noise measurement; on-die resistors; package capacitance; post-layout simulation; power supply noise reduction; Capacitance; Capacitors; Inductance; Microprocessors; Noise reduction; Packaging; Paramagnetic resonance; Power supplies; Resistors; Timing; Capacitors; decoupling of systems; noise; noise measurement;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2005.847802
Filename :
1492513
Link To Document :
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