DocumentCode
1130779
Title
Design and Validation of a Power Supply Noise Reduction Technique
Author
Ji, Gang ; Arabi, Tawfik R. ; Taylor, Greg
Author_Institution
Intel Corp., Santa Clara, CA, USA
Volume
28
Issue
3
fYear
2005
Firstpage
445
Lastpage
448
Abstract
For the high-performance microprocessors with high-bandwidth I/O, the power supply noise needs to be controlled to ensure reliable high speed bus operation. This is generally done with high-quality package capacitors. These capacitors are generally lower equivalent series inductance (ESL) and lower equivalent series resistor (ESR). In this paper, we will present two implementations of an approach of using on-die resistors in series with the package capacitance to dampen the high-frequency noise. We will show by validation on the 90-nm technology that this technique is capable of reducing the noise by nearly 80% without adversely affecting the timings. The results of several validation experiments, including the measurement of noise and impedance of the I/O power delivery, and the post-layout simulation will also be presented.
Keywords
capacitors; chip scale packaging; electric noise measurement; integrated circuit noise; microprocessor chips; power supply circuits; resistors; 90 nm; I/O power delivery; equivalent series inductance; equivalent series resistor; high speed bus operation; high-frequency noise; high-performance microprocessors; high-quality package capacitors; impedance measurement; noise measurement; on-die resistors; package capacitance; post-layout simulation; power supply noise reduction; Capacitance; Capacitors; Inductance; Microprocessors; Noise reduction; Packaging; Paramagnetic resonance; Power supplies; Resistors; Timing; Capacitors; decoupling of systems; noise; noise measurement;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2005.847802
Filename
1492513
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