• DocumentCode
    1131310
  • Title

    Modeling techniques for energy-efficient system-on-a-chip signaling

  • Author

    Dhaou, I.B. ; Tenhunen, Hannu

  • Volume
    19
  • Issue
    1
  • fYear
    2003
  • Firstpage
    8
  • Lastpage
    17
  • Abstract
    In order to tackle noise, delay, and power in the deep-submicron age, the most efficient approach is to design power-efficient and robust signaling techniques that allow for reliable communication between CMOS gates. This is referred to as energy-efficient on-chip-signaling. To design, optimize, and compare different signaling schemes, it is important to properly model on-chip wires. This article describes several techniques used in interconnect modeling. It focuses on the efficient modeling of on-chip wires, investigates the impact of inductive and capacitive coupling on the quality of the signal and the wire-load model, and contains a quantification of the impact of the wire model on the design of efficient signaling techniques.
  • Keywords
    CMOS integrated circuits; RC circuits; RLC circuits; circuit optimisation; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; system-on-chip; CMOS gate communication; RC model; RLC wire; buffer insertion scheme; bus encoding; capacitive coupling; deep-submicron technology; delay; energy-efficient system-on-a-chip signaling; inductive coupling; interconnect modeling; modeling techniques; noise; noise optimization; on-chip wires; power-efficient robust signaling techniques; signal quality; signaling scheme optimization; wire-load model; Delay; Design optimization; Energy efficiency; Noise robustness; Power system modeling; Power system reliability; Semiconductor device modeling; Signal design; System-on-a-chip; Wires;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.2003.1175103
  • Filename
    1175103