Title :
Fast Reduced-Order Finite-Element Modeling of Lossy Thin Wires Using Lumped Impedance Elements
Author :
Lee, Shih-Hao ; Jin, Jian-Ming
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
The spatial discretization of a thin wire often leads to a highly dense mesh in the peripheral region and thus increases the computational burden. In this paper, lossy conducting wires are modeled with infinitely thin lumped impedance elements, which significantly reduce the modeling complexity while still offers an accurate broadband modeling. This paper also describes the incorporation of lumped elements into our model order reduction formulation and the tree-cotree splitting technique.
Keywords :
finite element analysis; lumped parameter networks; wires (electric); finite element modeling; highly dense mesh; lossy conducting wires; lossy thin wires; lumped impedance elements; order reduction formulation; peripheral region; spatial discretization; tree-cotree splitting; Bonding wire; finite element method; lumped element; model order reduction; thin wire approximation; tree-cotree splitting;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2015958