• DocumentCode
    1131470
  • Title

    Electrical isolation of InP and InGaAs using iron and krypton

  • Author

    Too, P. ; Ahmed, S. ; Gwilliam, R. ; Sealy, B.J.

  • Author_Institution
    Sch. of Electron. & Sci., Univ. of Surrey, Guildford, UK
  • Volume
    40
  • Issue
    20
  • fYear
    2004
  • Firstpage
    1302
  • Lastpage
    1304
  • Abstract
    Both n-type InP and InGaAs layers are electrically isolated using iron and krypton ion implantation at 77K to create thermally-stable highly resistive regions. The data suggests that, in both InP and InGaAs, chemical induced compensation operates above a post-implant annealing temperature of 500°C for iron implant isolation. However, in the case of krypton, damage induced isolation is the only compensation mechanism responsible for electrical isolation in both materials. The isolation scheme used looks promising to III-V semiconductor industries since such high sheet resistance values (∼107 Ω/sq) with a broad thermally-stable window are obtained for both n-type InP and InGaAs materials.
  • Keywords
    III-V semiconductors; annealing; carrier density; electric resistance; gallium arsenide; indium compounds; ion implantation; iron; krypton; semiconductor thin films; thermal stability; 77 K; III-V semiconductor industries; InGaAs layers; InP layers; InP:Fe; InP:Kr; damage induced isolation; electrical isolation; implant annealing temperature; iron ion implantation; krypton ion implantation; resistive regions; sheet resistance; thermally stable;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20045922
  • Filename
    1342170