DocumentCode
1131470
Title
Electrical isolation of InP and InGaAs using iron and krypton
Author
Too, P. ; Ahmed, S. ; Gwilliam, R. ; Sealy, B.J.
Author_Institution
Sch. of Electron. & Sci., Univ. of Surrey, Guildford, UK
Volume
40
Issue
20
fYear
2004
Firstpage
1302
Lastpage
1304
Abstract
Both n-type InP and InGaAs layers are electrically isolated using iron and krypton ion implantation at 77K to create thermally-stable highly resistive regions. The data suggests that, in both InP and InGaAs, chemical induced compensation operates above a post-implant annealing temperature of 500°C for iron implant isolation. However, in the case of krypton, damage induced isolation is the only compensation mechanism responsible for electrical isolation in both materials. The isolation scheme used looks promising to III-V semiconductor industries since such high sheet resistance values (∼107 Ω/sq) with a broad thermally-stable window are obtained for both n-type InP and InGaAs materials.
Keywords
III-V semiconductors; annealing; carrier density; electric resistance; gallium arsenide; indium compounds; ion implantation; iron; krypton; semiconductor thin films; thermal stability; 77 K; III-V semiconductor industries; InGaAs layers; InP layers; InP:Fe; InP:Kr; damage induced isolation; electrical isolation; implant annealing temperature; iron ion implantation; krypton ion implantation; resistive regions; sheet resistance; thermally stable;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20045922
Filename
1342170
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