• DocumentCode
    1131601
  • Title

    Design for Environment: An Environmentally Conscious Analysis Model for Modular Design

  • Author

    Qian, Xueqing ; Zhang, Hong C.

  • Author_Institution
    Dept. of Ind. Eng., Texas Tech Univ., Lubbock, TX, USA
  • Volume
    32
  • Issue
    3
  • fYear
    2009
  • fDate
    7/1/2009 12:00:00 AM
  • Firstpage
    164
  • Lastpage
    175
  • Abstract
    Nowadays, more and more manufacturing enterprises are working hard to improve the environmental performance of their products. Pollution may be generated through the life cycle of a product. To maximally improve a product´s overall environmental performance and reduce potential environmental impacts, Design for the Environment can be used as early as the design stage for the product. For electromechanical products, modular design is a widely used design method. While traditional modularity analysis pays little attention to environmental factors, this research aims at including comprehensive environmentally conscious criteria into modularity analysis. This paper presents a semi-quantitative environmentally conscious modular analysis model in order to reduce pollution. Eight criteria are identified to capture most of potential environmental impacts of modular products, some of which are fuzzy criteria. Fuzzy Analytic Hierarchy Process is used to rank these environmental criteria, and fuzzy numbers are used to map some uncertain judgments of decision makers with crisp numbers. Structure of a product is represented as a fuzzy graph. The proposed modularity analysis includes similarity analysis and independence analysis. In the end, an example is given to illustrate the developed methodology.
  • Keywords
    design for environment; fuzzy systems; numerical analysis; design for environment; electromechanical products; fuzzy analytic hierarchy process; fuzzy graph; modular design; modularity analysis; Design methodology; Environmental factors; Environmentally friendly manufacturing techniques; Industrial engineering; Performance analysis; Pollution; Process design; Product design; Telecommunication computing; Virtual manufacturing; Design for the environment (DFE); environmentally conscious modular criteria; fuzzy analytic hierarch process; modular design; modularity analysis;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2009.2022544
  • Filename
    5161444