DocumentCode
1132011
Title
IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Volume
32
Issue
3
fYear
2009
fDate
7/1/2009 12:00:00 AM
Abstract
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2009.2026779
Filename
5161703
Link To Document