DocumentCode
1132215
Title
Skin Effect Modeling Based on a Differential Surface Admittance Operator
Author
De Zutter, Daniël ; Knockaert, Luc
Author_Institution
Dept. of Inf. Technol., Ghent Univ., Gent, Belgium
Volume
53
Issue
8
fYear
2005
Firstpage
2526
Lastpage
2538
Abstract
An important issue in high-frequency signal integrity prediction is the modeling of the skin effect of thick conductors. A new differential surface admittance concept is put forward allowing to replace the conductor by equivalent electric surface currents and to replace the material of the conductor by the material of the background medium the conductor is embedded in. This new concept is studied in detail for the two-dimensional TM case starting from the Dirichlet eigenfunctions of the cross section. Detailed expressions are derived for the important practical case of a rectangular cross section. Next, the differential surface admittance operator is exploited to determine the resistance and inductance matrices of a set of multiconductor lines. A first set of numerical results provides the reader with some insight into the behavior of the surface admittance matrix. A second set of results demonstrates the correctness and versatility of the new approach to determine inductance and resistance matrices.
Keywords
conductors (electric); current distribution; eigenvalues and eigenfunctions; multiconductor transmission lines; skin effect; surface impedance; Dirichlet eigenfunctions; differential surface admittance operator; equivalent electric surface currents; high-frequency signal integrity prediction; inductance matrices; multiconductor lines; rectangular cross section; resistance matrices; skin effect modeling; surface admittance matrix; thick conductors; two-dimensional TM case; Admittance; Clocks; Conducting materials; Conductors; Current distribution; Frequency; Inductance; Predictive models; Skin effect; Surface resistance; Inductance matrix; resistance matrix; skin effect; surface admittance;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2005.852766
Filename
1492650
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