Measurement of a 24-GHz broad-band multilayer ceramic feedthru for microwave packaging

Author

Goetz, Martin P. ; Mancias, Gregorio, III

Author_Institution

Alcoa Electron. Packaging Inc., San Diego, CA, USA

Volume

2

Issue

5

fYear

1992

fDate

5/1/1992 12:00:00 AM

Firstpage

171

Lastpage

173

Abstract

A feedthrough using a microstrip to stripline to conductor backed coplanar waveguide (CBCWG) design was investigated for microwave performance. The feedthrough was manufactured using a high-temperature cofired multilayer ceramic process. The study was instigated from the need to have a field-replaceable, Ku-band transmit/receive module as part of an existing DARPA MIMIC program. The result is a feedthrough capable of transmitting microwave frequencies to 24 GHz with acceptable loss characteristics. The feedthrough performance exceeds published results.<>

Keywords

integrated circuit technology; microwave integrated circuits; modules; packaging; strip line components; 24 GHz; CPW; DARPA MIMIC program; Ku-band; MIC; MLC; SHF; broadband type; cofired multilayer ceramic process; coplanar waveguide; feedthrough; field replaceable module; high-temperature; interconnect technology; microwave packaging; transmit/receive module; Ceramics; Coplanar waveguides; Microstrip; Microwave devices; Microwave measurements; Nonhomogeneous media; Packaging; Routing; Stripline; Vehicles;

fLanguage

English

Journal_Title

Microwave and Guided Wave Letters, IEEE

Publisher

ieee

ISSN

1051-8207

Type

jour

DOI

10.1109/75.134344

Filename

134344