TSV-based 3D integration fabrication technologies: An overview

3D Integration is a promising and attractive solution for interconnect bottleneck problem, transistor scaling physical limitations, and impractical small-scale lithography. 3D integration extends Moore´s law in the third dimension, offering heterogeneous integration, higher density, lower power consumption, and faster performance. However, in order to fabricate 3D ICs, new capabilities are needed: process technology, physical modeling, physical design tools, 3D architectures, design methods and tools. The goal of this paper is to cover the manufacturability of TSV-based 3D-ICs Le. process technology, and fabrication capability.