DocumentCode
1133249
Title
A capacitive fingerprint sensor chip using low-temperature poly-Si TFTs on a glass substrate and a novel and unique sensing method
Author
Hashido, Ryuichi ; Suzuki, Akihiro ; Iwata, Akihiko ; Okamoto, Tatsuki ; Satoh, Yukio ; Inoue, Mitsuo
Author_Institution
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Volume
38
Issue
2
fYear
2003
fDate
2/1/2003 12:00:00 AM
Firstpage
274
Lastpage
280
Abstract
We have developed a capacitive fingerprint sensor chip using low-temperature poly-Si thin film transistors (TFTs). We have obtained good fingerprint images which have sufficient contrast for fingerprint certification. The sensor chip comprises sensor circuits, drive circuits, and a signal processing circuit. The new sensor cell employs only one transistor and one sensor plate within one cell. There is no leakage current to other cells by using a new and unique sensing method. The output of this sensor chip is an analog wave and the designed maximum output level is almost equal to the TFT´s threshold voltage, which is 2-3 V for low-temperature poly-Si TFTs. We used a glass substrate and only two metal layers to lower the cost. The size of the trial chip is 30 mm×20 mm×1.2 mm and the sensor area is 19.2 mm×15 mm. The size of the prototype cell is now 60 μm×60 μm at 423 dpi, but it will be easy to increase the resolution up to more than 500 dpi. The drive frequency is now 500 kHz and the power consumption is 1.2 mW with a 5-V supply voltage. This new fingerprint sensor is most suitable for mobile use because the sensor chip is low cost and in a thin package with low power consumption.
Keywords
array signal processing; capacitive sensors; field effect integrated circuits; fingerprint identification; glass; low-power electronics; silicon; substrates; thin film transistors; 1.2 mW; 15 mm; 19.2 mm; 2 to 3 V; 5 V; 500 kHz; 60 micron; Si; biometrics; capacitive fingerprint sensor chip; drive circuits; fingerprint certification; fingerprint images; glass substrate; low cost sensor chip; low power consumption; low-temperature polysilicon TFTs; mobile use; poly-Si TFTs; poly-Si thin film transistors; sensor circuits; signal processing circuit; thin package; Capacitive sensors; Circuits; Costs; Energy consumption; Fingerprint recognition; Glass; Image matching; Substrates; Thin film sensors; Thin film transistors;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2002.807172
Filename
1175508
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