DocumentCode :
1133594
Title :
A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients
Author :
Koo, Jayong ; Han, Lijun ; Herrin, Scott ; Moseley, Richard ; Carlton, Ross ; Beetner, Daryl G. ; Pommerenke, David
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Volume :
51
Issue :
3
fYear :
2009
Firstpage :
611
Lastpage :
619
Abstract :
A nonlinear power distribution network model for characterizing the immunity of integrated circuits (ICs) to electrical fast transients (EFTs) is proposed and validated. The model includes electrostatic discharge (ESD) protection diodes and passive impedances between power domains. Model parameters are based on external measurements using a vector network analyzer and curve tracer. Impedance is measured between pins while the IC is biased and operating, and is used to determine individual elements of the network model. Inclusion of active power-clamp circuitry is also explored. The model is able to successfully predict pin currents and voltages during EFTs on the power pin when the IC is operating or turned off and when the ESD power clamp is either activated or not activated. This model might be used to evaluate the immunity of the IC in a variety of systems and to better understand why failures occur within the IC and how to fix them.
Keywords :
clamps; microcontrollers; network analysers; power integrated circuits; transient response; active power-clamp circuitry; curve tracer; electrical fast transient; electrostatic discharge protection diodes; integrated circuits; nonlinear microcontroller power distribution network model; passive impedance; vector network analyzer; Diodes; Electrostatic discharge; Electrostatic measurements; Impedance measurement; Integrated circuit measurements; Integrated circuit modeling; Microcontrollers; Pins; Power systems; Protection; Electrostatic discharge (ESD); modeling; power distribution;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2009.2023670
Filename :
5164925
Link To Document :
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