Title :
Model quality needs to be job one [circuit CAD]
Author_Institution :
Maxim Integrated Products, Sunnyvale, CA, USA
fDate :
11/1/2002 12:00:00 AM
Abstract :
A SPICE model is a tool for circuit designers to design their chip. As the design activity shifts from purely digital to increasingly analog/RF applications, an accurate model with smooth device characteristics becomes essential. BSIM3 gains popularity because of its capability to meet these challenges. As CMOS processing evolves and various tunneling/leakage currents begin to surface, companies are exploring BSIM4 for their immediate future use. Regardless of which model is selected, the entire QA flow must be executed before a model is released to the design community. The four essential steps are to ensure 1) there is no kink in the conductance and capacitance calculated in the model; 2) the process specifications are reflected in the model; 3) the trend of various parameters make sense as a function of channel width, length, and device temperature; and finally, 4) the figure of merit from simulating the benchmark circuit is consistent with previous models.
Keywords :
CMOS integrated circuits; SPICE; capacitance; circuit CAD; integrated circuit design; leakage currents; quality control; tunnelling; BSIM3; BSIM4; CMOS; QA flow; SPICE model; benchmark circuit; capacitance; channel width; circuit CAD; conductance; design community; device characteristics; device temperature; leakage currents; process specifications; tunneling currents; CMOS process; Capacitance; Circuits; Design automation; Leakage current; Radio frequency; SPICE; Semiconductor device modeling; Temperature sensors; Tunneling;
Journal_Title :
Circuits and Devices Magazine, IEEE
DOI :
10.1109/MCD.2002.1175758
