Title :
High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors
Author :
Seo, Sang-Woo ; Cho, Sang-Yeon ; Huang, Sa ; Shin, Jeng Jung ; Jokerst, Nan Marie ; Brown, April S. ; Brooke, Martin A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Abstract :
Inverted metal-semiconductor-metal (I-MSM) photodetectors, which are thin-film MSMs with the growth substrate removed and fingers on the bottom of the device (to eliminate finger shadowing to enhance responsivity), are reported herein for high-speed high-efficiency large-area photodetectors. Reported herein are the highest speed vertically addressed large-area (40-μm diameter) photodetectors reported to date, which operate with a responsivity of 0.16 A/W and a full-width half-maximum of less than 5 ps. Materials, fabrication processes, heterogeneous integration, and characterization of I-MSM photodetectors are presented in this paper, as measured using a fiber-based electrooptic sampling system. These large-area photodetectors are ideal for vertically addressed high-speed optical links which need alignment-tolerant packaging for cost sensitive applications.
Keywords :
III-V semiconductors; gallium arsenide; high-speed optical techniques; indium compounds; integrated optoelectronics; metal-semiconductor-metal structures; photodetectors; signal sampling; thin film devices; 40 mum; InGaAs; InGaAs photodetectors; alignment-tolerant packaging; fiber-based electrooptic sampling; high-speed optical links; high-speed photodetectors; inverted metal-semiconductor-metal photodetectors; large-area photodetectors; thin film photodetector; vertically addressed optical links; Fingers; Indium gallium arsenide; Optical device fabrication; Optical materials; Photodetectors; Sampling methods; Shadow mapping; Substrates; Thin film devices; Transistors; Electro-optic sampling; MSM; high-speed photodetector; metal–semiconductor–metal; photodetector; thin-film photodetector;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2004.831677