Title :
A novel assembling technique for fiber collimator arrays using UV-curable adhesives
Author :
Zhou, Hong ; Liu, Wenning ; Lin, Yaomin ; Mondal, Samir K. ; Shi, Frank G.
Author_Institution :
OptoElectronics Packaging & Autom. Lab., Univ. of California, Irvine, CA, USA
fDate :
11/1/2002 12:00:00 AM
Abstract :
Packaging and assembly covers almost 80% of the overall cost of any fiber-optic devices. It is thus a demanding issue to lower the cost of fiber-optic alignment and attachment process. This work summarizes the results for the development of automated alignment and attachment processes for the packaging of 1×8 collimator arrays, which are critical for many photonic devices. The emphasis of this work is on the comparison of the use of three different UV-curing adhesives (Adhesives A, B, and C). It is concluded that regardless of curing shrinkage, a proper adhesive joint design can alleviate the optical loss effect of the relative fiber-lens displacement induced during curing and the subsequent cooling processes.
Keywords :
adhesives; assembling; curing; optical arrays; optical collimators; optical fibre couplers; optical fibre fabrication; optical fibre losses; packaging; UV-curable adhesives; adhesive joint design; assembling technique; automated alignment; collimator arrays; curing shrinkage; fiber collimator arrays; fiber-lens displacement; fiber-optic alignment; fiber-optic attachment; optical loss effect; packaging; Assembly; Costs; Curing; Optical attenuators; Optical collimators; Optical devices; Optical fiber devices; Optical fibers; Packaging; Space technology;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.807602