• DocumentCode
    1135520
  • Title

    Impact of Electrode Materials on Resistive-Switching Memory Programming

  • Author

    Russo, Ugo ; Cagli, Carlo ; Spiga, Sabina ; Cianci, Elena ; Ielmini, Daniele

  • Author_Institution
    Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
  • Volume
    30
  • Issue
    8
  • fYear
    2009
  • Firstpage
    817
  • Lastpage
    819
  • Abstract
    This letter addresses the impact of electrode materials on programming characteristics of NiO-based resistive-switching memory devices. The use of noble metals for the electrodes, instead of Si contacts, is shown to result in a lowering of the set/reset voltage. This is ascribed to a different chemical composition of the conductive filament (CF) in the set state for varying electrodes, suggesting that atomic diffusion from the electrodes takes place during the formation of the CF at the set process. The results are interpreted on the basis of numerical simulations of the reset transition, which are compared with experimental data.
  • Keywords
    electric breakdown; elemental semiconductors; nickel compounds; numerical analysis; random-access storage; silicon; NiO; Si; atomic diffusion; conductive filament; electrode materials; numerical simulations; resistive-switching memory devices; resistive-switching memory programming; Dielectric breakdown; electrothermal modeling; nonvolatile memories; resistive-switching memory (RRAM); transition metal oxide;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2025061
  • Filename
    5165098